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Multimetallic Au/FePt3 nanoparticles as highly durable electrocatalyst.
Wang C, van der Vliet D, More KL, Zaluzec NJ, Peng S, Sun S, Daimon H, Wang G, Greeley J, Pearson J, Paulikas AP, Karapetrov G, Strmcnik D, Markovic NM, Stamenkovic VR. Wang C, et al. Among authors: greeley j. Nano Lett. 2011 Mar 9;11(3):919-26. doi: 10.1021/nl102369k. Epub 2010 Aug 12. Nano Lett. 2011. PMID: 20704335
Stabilization of copper catalysts for liquid-phase reactions by atomic layer deposition.
O'Neill BJ, Jackson DH, Crisci AJ, Farberow CA, Shi F, Alba-Rubio AC, Lu J, Dietrich PJ, Gu X, Marshall CL, Stair PC, Elam JW, Miller JT, Ribeiro FH, Voyles PM, Greeley J, Mavrikakis M, Scott SL, Kuech TF, Dumesic JA. O'Neill BJ, et al. Among authors: greeley j. Angew Chem Int Ed Engl. 2013 Dec 16;52(51):13808-12. doi: 10.1002/anie.201308245. Epub 2013 Nov 26. Angew Chem Int Ed Engl. 2013. PMID: 24282166
Trimethylaluminum and Oxygen Atomic Layer Deposition on Hydroxyl-Free Cu(111).
Gharachorlou A, Detwiler MD, Gu XK, Mayr L, Klötzer B, Greeley J, Reifenberger RG, Delgass WN, Ribeiro FH, Zemlyanov DY. Gharachorlou A, et al. Among authors: greeley j. ACS Appl Mater Interfaces. 2015 Aug 5;7(30):16428-39. doi: 10.1021/acsami.5b03598. Epub 2015 Jul 23. ACS Appl Mater Interfaces. 2015. PMID: 26158796 Free PMC article.
Rational Development of Ternary Alloy Electrocatalysts.
Wang C, Li D, Chi M, Pearson J, Rankin RB, Greeley J, Duan Z, Wang G, van der Vliet D, More KL, Markovic NM, Stamenkovic VR. Wang C, et al. Among authors: greeley j. J Phys Chem Lett. 2012 Jun 21;3(12):1668-73. doi: 10.1021/jz300563z. Epub 2012 Jun 6. J Phys Chem Lett. 2012. PMID: 26285726
126 results