Wafer Bonding of SiC-AlN at Room Temperature for All-SiC Capacitive Pressure Sensor.
Mu F, Xu Y, Shin S, Wang Y, Xu H, Shang H, Sun Y, Yue L, Tsuyuki T, Suga T, Wang W, Chen D.
Mu F, et al. Among authors: wang w, wang y.
Micromachines (Basel). 2019 Sep 23;10(10):635. doi: 10.3390/mi10100635.
Micromachines (Basel). 2019.
PMID: 31547592
Free PMC article.