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Kim J, Dong F, Kim J, Bascunan J, Iwasa Y, Ackerman JL, Park D.Kim J, et al. Among authors: bascunan j.IEEE Trans Appl Supercond. 2024 Aug;34(5):4704306. doi: 10.1109/tasc.2024.3360024. Epub 2024 Jan 31.IEEE Trans Appl Supercond. 2024.PMID: 39386117
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Park D, Dong F, Lee W, Bascuñán J, Iwasa Y.Park D, et al. Among authors: bascunan j.IEEE Trans Appl Supercond. 2023 Aug;33(5):4300104. doi: 10.1109/tasc.2023.3252487. Epub 2023 Mar 3.IEEE Trans Appl Supercond. 2023.PMID: 37789845Free PMC article.
Park D, Bascuñán J, Lee W, Iwasa Y.Park D, et al. Among authors: bascunan j.IEEE Trans Appl Supercond. 2023 Aug;33(5):4400304. doi: 10.1109/tasc.2023.3242228. Epub 2023 Feb 3.IEEE Trans Appl Supercond. 2023.PMID: 37638131Free PMC article.
Dong F, Park D, Kim J, Bascuñán J, Iwasa Y.Dong F, et al. Among authors: bascunan j.IEEE Trans Appl Supercond. 2023 Aug;33(5):4600105. doi: 10.1109/tasc.2023.3238987. Epub 2023 Jan 23.IEEE Trans Appl Supercond. 2023.PMID: 36816464Free PMC article.
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Park D, Lee W, Bascuñán J, Kim HM, Iwasa Y.Park D, et al. Among authors: bascunan j.IEEE Trans Appl Supercond. 2022 Sep;32(6):4602305. doi: 10.1109/tasc.2022.3161401. Epub 2022 Mar 23.IEEE Trans Appl Supercond. 2022.PMID: 36185339Free PMC article.
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