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Kim HE, Kim JH, Jeong HI, Cho YT, Salem O, Jung DW, Lee CM.Kim HE, et al. Among authors: lee cm.Micromachines (Basel). 2024 Sep 27;15(10):1196. doi: 10.3390/mi15101196.Micromachines (Basel). 2024.PMID: 39459069Free PMC article.
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Lim JS, Oh WJ, Lee CM, Kim DH.Lim JS, et al. Among authors: lee cm.Sci Rep. 2021 Dec 17;11(1):24169. doi: 10.1038/s41598-021-03622-z.Sci Rep. 2021.PMID: 34921196Free PMC article.
Yoo SW, Lee CM, Kim DH.Yoo SW, et al. Among authors: lee cm.Materials (Basel). 2023 Jan 5;16(2):535. doi: 10.3390/ma16020535.Materials (Basel). 2023.PMID: 36676271Free PMC article.
Lee JY, Kim DH, Cho YT, Lee CM.Lee JY, et al. Among authors: lee cm.Materials (Basel). 2023 Nov 30;16(23):7463. doi: 10.3390/ma16237463.Materials (Basel). 2023.PMID: 38068207Free PMC article.
Song GH, Lee CM, Kim DH.Song GH, et al. Among authors: lee cm.Materials (Basel). 2021 Oct 28;14(21):6477. doi: 10.3390/ma14216477.Materials (Basel). 2021.PMID: 34772002Free PMC article.
Lee YH, Lee CM.Lee YH, et al. Among authors: lee cm.Materials (Basel). 2019 Aug 14;12(16):2590. doi: 10.3390/ma12162590.Materials (Basel). 2019.PMID: 31416249Free PMC article.
Kim DO, Lee CM, Kim DH.Kim DO, et al. Among authors: lee cm.Heliyon. 2023 Dec 7;10(1):e23372. doi: 10.1016/j.heliyon.2023.e23372. eCollection 2024 Jan 15.Heliyon. 2023.PMID: 38163153Free PMC article.