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Extending Copper Interconnects and Epoxy Dielectrics to Multi-GHz Frequencies.
Park J, Xu J, Engler A, Williamson J, Mathew V, Park S, Flake J. Park J, et al. Among authors: park s. IEEE Trans Compon Packaging Manuf Technol. 2024 Jun;14(6):984-992. doi: 10.1109/tcpmt.2024.3399662. Epub 2024 May 9. IEEE Trans Compon Packaging Manuf Technol. 2024. PMID: 39309372
3D nanomolding for lab-on-a-chip applications.
Farshchian B, Park S, Choi J, Amirsadeghi A, Lee J, Park S. Farshchian B, et al. Among authors: park s. Lab Chip. 2012 Nov 21;12(22):4764-71. doi: 10.1039/c2lc40572e. Lab Chip. 2012. PMID: 22990333
Droplet Impinging Behavior on Surfaces with Wettability Contrasts.
Farshchian B, Pierce J, Beheshti MS, Park S, Kim N. Farshchian B, et al. Among authors: park s. Microelectron Eng. 2018 Aug 5;195:50-56. doi: 10.1016/j.mee.2018.03.019. Epub 2018 Mar 20. Microelectron Eng. 2018. PMID: 30270957 Free PMC article.
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